THERMAL 2023

CONFERENCE SCHEDULE

 

8 March 2023 (Wednesday)

 

 

09.25 am                                 Opening address & table tops presentation

Jean-Yves Soulier, Conference chairman & IMAPS France Treasurer

 

Session 1: ACTIVE & PASSIVE TWO-PHASE COOLING

Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)

 

09.40 am                                             Enhanced Two-Phase and Air-Side Thermal Management

Thomas Boziuk, Sourabh Jha, and Ari Glezer

(Georgia Institute of Technology, United States)

 

10:05 am                                                        Novel 2ΦMPL cooling circuit evaporator design for highly dissipative space electronic     Benjamin Lagier^1,2, Frédéric Boudesseul^1,3, Laure Baert^1,4

                                               (¹IRT Saint-Exupéry ; ²Airbus Defense and Space ; ³THALES Alenia Space ; ⁴EPSILON, Toulouse, France)

 

10.30 am-10.55 am                                         Coffee Break / Table Top Exhibition

 

 

SESSION 1 (cont’d):  ACTIVE & PASSIVE TWO-PHASE COOLING

Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Alexandre Val (Valeo)

 

10.55 am                                 Study of instabilities in a two-phase Thermosyphon Loop for power converter cooling Georgena Selva, Etienne Videcoq, Julien Caner, Adel Benselama, Manuel Girault

                                               (Institut Pprime UPR CNRS 3346 – CNRS / ENSMA / Univ. Poitiers, France, France)

                                              

11:20 am                                 3D printed polymer-based two-phase cooling system for power electronic devices

Tony Gerges¹, Alexandre Marie², Thilini Wickramasinghe¹, Vincent Semet¹, Philippe Lombard¹, Stéphane Lips², Valérie Sartre², Bruno Allard¹, Michel Cabrera¹

(¹Univ Lyon, INSA Lyon, Université Claude Bernard Lyon 1, École Centrale de Lyon, CNRS, Ampère, UMR5505, 69621 ; ²Univ Lyon, INSA Lyon, CNRS, CETHIL UMR5008, F-69621, Villeurbanne, France)

 

11.45 am                                          New flat plate pulsating heat pipe for electric-car battery cooling

Thibault Van’t Veer^1,2, Vincent Ayel², Mouad Diny¹, Yves Bertin², Etienne Videcoq²)

(¹ Stellantis – Carrières sous Poissy, France ; ² Institut PPRIME, ENSMA Poitiers France)

 

12:10 am – 01.55 pm               Lunch

 

SESSION 2: MODELLING AND SIMULATION

Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Jean-Yves Soulier (Safran Data Systems)

 

01.55 pm                                 Modelling of the local electro-thermal behavior of discrete power diode using Verilog-A in a standard CAD environment

Achraf Kaïd¹, Fabrice Roqueta¹, Jean-Baptiste Kammerer², Luc Hébrard²

(¹STMicroelectronics, Tours, France ; ²ICube-CNRS, Strasbourg, France)

 

02:20 pm                                             Thermal Interface Material FEA characterization and selection for an EPS module package RBT robustness

Dandy N. Jaducana, Bernard Pepito Malolos, Leonel Soberano

(Integrated Micro-Electronics, Inc, Philippines)

 

02.45 pm                                 Thermal model assessment of an industrial 0.15μm AlGaN/GaN HEMT technology Laurent Brunel¹, Christophe Chang¹, Dominique Carisetti²

(¹UMS, ²Thales R&T, France)

 

03.10 pm – 03.40 pm                                      Coffee Break / Table Top Exhibition

 

 

03.40 pm                                 Real-valued optimization of multi-node network for thermal modelling of electronic package using differential evolution algorithm

Eric Monier-Vinard, (ANSYS & Paris Nanterre University, France)

 

 

SESSION 3: LIQUID COOLING

Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)

 

04.05 pm                                             Self-adaptive structures acting as vortex generators for microelectronics liquid cooling M. Vilarrubí^1,3, D. Regany¹, M. Ibáñez¹, J. Rosell¹, A. Amnache², É. Léveillé², L.-G. Fréchette^2,3, J. Barrau^1,3

(¹Dynamic Systems Applied to Solar Energy Research Group, University of Lleida, 25001 Lleida, Spain

²Interdisciplinary Institute for Technological Innovation (3IT) and UMI-LN2, Université de Sherbrooke, 2500 Sherbrooke (Québec), Canada.

³ UniSCool – Universal Smart Cooling S.L., Lleida, Spain)

 

04.30 pm                                             Thermal Interface Materials in Liquid Immersion for Power Electronics and Computing Systems

                                               Dave Saums, (DS&A LLC – USA)

 

04.55 pm – 05:20 pm               End of 1st day Sessions / Table top Exhibition

 

05:50 pm – 10:00 pm            Social Event – Futuroscope Spectacle – Dinner

 

 

9th MARCH, 2023 (Thursday)

                                                                         

 

SESSION 4: CHARACTERIZATION AND TESTS, RELIABILITY, MATERIALS

Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Alexandre Val (Valeo)

 

08.45 am                                  Applications of High Thermal Conductivity Graphene Enhanced Thermal Interface

Materials

1. Murugesan¹, K. Martinsen¹, M. Enmark², D. Blomdahl¹, H. Zhang¹, J. Liu^1,2, L. Almhem¹

(¹Smart High-Tech, Arendals Allé 3 SE-418 79 Gothenburg, Sweden

²Department of Microtechnology and Nanoscience (MC2), Chalmers University of

Technology, Sweden)

 

09.10 am                                 Inline Failure Analysis of Sintered and Soldered Layers in Power Modules using Infrared Thermography

1. Panahandeh¹, D. May^1,2, C. Grosse-Kockert¹, M. Abo Ras¹

                                               (¹Berliner Nanotest; ²TU Chemnitz, Germany)

 

09.35 am                                 Evolution of the thermal conductivity of sintered Ag paste as a function of the density and aging

Anas Sghuri, Yann Billaud, Loïc Signor, Didier Saury, Xavier Milhet

(Institut Pprime UPR CNRS 3346 – CNRS / ENSMA / Univ. Poitiers, France)

 

 

10:00 am – 10.30 am                    Coffee Break/ Table top Exhibition

 

 

SESSION 4 (cont’d):  CHARACTERIZATION & TESTS, RELIABILITY

Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Jean-Yves Soulier (Safran Data Systems)

 

10.30 am                                 Assessment of embedded GaN HEMT junction temperature measurement accuracy Alexandre Marie¹, Jean-Pierre Fradin¹, Laurence Allirand², Michel Aussel², Pierre-Yves Hamelin³

(¹ICAM Toulouse ; ²VITESCO Technologies ; ³ELVIA PCB -France)

 

10.55 am                                                         Thermo-mechanical investigation of microelectronics on component and system level M. Eichhorst¹ – L. Scheiter¹ – E.Noak^1,2 – B.Seiler¹– S.Rzepka²

(¹Chemnitzer Werkstoffmechanik GmbH ;²Fraunhofer-Institut für Elektronische Nanosysteme ENAS, Germany)

 

                                                          

11.20 pm                                 Use of thermal impedance analysis to determine physical defects of an innovative power module

Louis Alauzet¹, Jean-Pierre Fradin¹, Patrick Tounsi², Jacques Favre³

(¹Icam Toulouse, France ; ²CNRS, INSA, LAAS, Toulouse ; ³aPSI³D, Tarbes, France)

 

11.45 pm                                 Aging Investigations under Mechancial Stress on Thermal Interface Materials

                        Santiago Campos-Boettges, Antonio Harder and Mohamad Abo Ras

                        (Berliner Nanotest, Germany)

 

12.10 am – 1:40 pm                     Lunch

 

SESSION 5: APPLICATIONS AND THERMAL ARCHITECTURE

Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)

 

 

01.40 pm                                         Thermal Management at System Level for More Electrical Aircraft

Laurent Lachassagne (Liebherr Aerospace, Toulouse, France)

 

02.05 pm                                         How to Achieve a High Thermal Conductivity for Composite Packaging

Muriel Sabah

(Safran Electronics and Defense, Massy, France)

 

02.30 pm                                 Improvement of the thermal performance of printed circuit boards by embedding of graphite heat spreaders

Ahmed Sabry Ahmed¹, Rémi Perrin¹, Cyril Buttay², Jacques Jay³

(¹Mitsubishi Electric R&D Centre Europe ; ²laboratoire Ampère, CNRS, ³CETHIL INSA de Lyon, France)

 

02.55 pm                                 Direct Cooling of Power Modules by Two-Phase Systems

Antoine Loerhmann¹, Vincent Ayel², Etienne Videcoq², Sébastien Dutour³, Benjamin Piaud⁴, Olivier Crépel¹

(¹Electrification Technologies – 1XRE, AIRBUS CTO / Central R&T, 31700 Toulouse,France ;                     ²Institut PPRIME, CNRS-ENSMA-Université de Poitiers, 86360 Futuroscope-Chasseneuil,             France ; ³ LAPLACE, UPS, INPT, CNRS, Université de Toulouse, 31555 Toulouse, France ;
 ⁴ Méso-Star, 8 Rue des Pêchers, 31410 LONGAGES. France)

 

End of Conferences/Closing address: J-Y Soulier, Conference Chairman

 

3.20 pm – 03.35 pm                  Final coffee break and farewell

 

 

03.35 pm – 05.05 pm           BONUS! Second ENSMA Thermal Lab Tour