Review from the Chapters of IMAPS-Europe
Dear Microelectronics and Packaging Professional,
Report on the 24th European Microelectronics and Packaging Conference
IMAPS-Europe is a Technical Society registered in Europe and is composed of European Chapters delivering knowledge, networking and training in the field of Microelectronics and Packaging. IMAPS-Europe organizes webinars, conferences and Professional Development Courses (PDCs).
The latest was the European Microelectronics and Packaging Conference (EMPC-2023) held at The Genome Centre in Cambridge in September 2023, attended by 278 international engineers and scientists. Included in the Conference were 78 leading technical papers, 5 Keynotes by experts and 4 PDCs taught by professionals.
Knowledge was delivered by the technical papers and leading-edge Keynotes
The Keynotes were presented by leaders in the field:
# Interconnecting Chiplets, Chris Scanlan, Senior Vice President Technology, BESI Switzerland
# Advanced Packaging – Challenges that are driving new package innovation & ecosystem needs, Mark Gerber, Sr. Director Engineering, ASE Group
# Wide Bandgap Devices and Multi-dimensional Architectures in the New Era of Power Electronics, Professor Florin Udrea, Cambridge GaN Devices
# The challenges of integrating graphene into existing packages, Dr. Ali Murad, Test & Packaging Engineer. Paragraf
# Reinventing Electronics for a Sustainable World, Dr Feras Alkhalil, Principal Scientist and Director of R&D, Pragmatic Semiconductor
Training was delivered through the PDCs
# “Evolution of Die Attach Adhesives & Encapsulants used in Semi-Conductor Packaging”, Instructed by Tony Winster, Henkel Ltd. – attended by 14 participants
# “Fan-out, Chiplet Design, and Heterogeneous Integration Packaging”, Instructed by John H. Lau, Unimicron Technology Corporation – attended by 21 participants
# “Power Electronics Packaging – Understanding the Packaging Processes”, Instructed by Andy Longford, PandA Europe – attended by 11 participants
# “From Wafer to Panel Level Packaging”, Instructed by Tanja Braun and Markus Wöhrmann, Fraunhofer IZM – attended by 17 participants
Each PDC participant was awarded a Certificate from IEEE-EPS in recognition of the value of learning through the PDCs
The IMAPS-Europe team
13th -16th September 2022:ESTC2022
The Electronics System-Integration Technology Conference (ESTC) is a premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.