MiNaPAD 2022

Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on june 23th-24th, 2022.

MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

parallel technical sessions
an exhibition
additional technical events

Grenoble – Europe’s conveniently located technology cluster for semiconductor research, design and manufacturing – easy access to Lyon (1 hour), Geneva (2 hours), Paris (3 hours by high speed train– TGV) airports

Venue

ACCOMMODATIONS

ACCESS MAP

By train

Train station at 100m of Congress center
Several daily connections with Europe’s big cities:
Grenoble-Paris: 10 direct TGV high speed trains, in 3 hours
Grenoble-Lille-Bruxelles: 1 TGV high speed train per week, in 5.5 hours
Grenoble-Paris-Cologne: 4 TGV high speed trains per day, in 8 hours
Grenoble-Turin-Milan: 3 round trips per day;

By road

A crossroads, Grenoble is particularly easy to access? Arrival by motorways A48 (Lyon, Valence), A41 (Chambery, Annecy), and A51 (Marseille)

A few distances

Grenoble-Paris: 574 km
Grenoble-Nice: 343 km
Grenoble-Strasbourg: 535 km
Grenoble-Geneva: 147 km

Categories	Number	Capacity
Hotel****	2	55
Hotel***	23	1420
Hotel**	50	1868
Hotel*	6	586
Total	81	3929

Plane

Attractive discounts, up to -15%, on a wide range of public fares on all AIR FRANCE, KLM and their code-shared flights worldwide.

Event: MiNaPAD Forum 2022

ID Code:

Travel Valid Period:

Event location: Grenoble

Please visit the event website or access directly through http://globalmeetings.airfranceklm.com/Search/promoDefault.aspx?vendor=AFR&promocode=36283AF

Grenoble Airport Isère 40 minutes

http://www.grenoble-airport.com

Railway station-Airport every three hours from 5.15 am to 6.05 pm Time 45mn

Airport-Railway station every three hours from 10.10am to 10.30 pm

Lyon St Exupery Aiport distance 50 minutes

http://www.lyon.aeroport.fr

Shuttles:

Airport-Grenoble every hour 7.30 am to 7.00pm

Time 1 hour

Grenoble-Airport every hour 5.00 am to 7.00

Time 1 hour

Geneve Airport Cointrin distance 1.30 pm

http://www;gva.ch

Shuttles

Airport –Grenoble every 3 hours 8.30 am to 7.30 pm time 2 hours

Grenoble-Airport every 3 hours 6.00 am to 4.00 pm time 2 hours

Local Transport

Tramway

Line A Stop Railway station

Line B Stop Palais de Justice

Parking

Europole Railway Station 600 places, rue du Doyen Louis Weil

Le Doyen 400 places, rue du Doyen Louis Weil

Program

Wednesday June 22^th

Afternoon: 16h00 to 17h30 – Lecture “Packaging of Photonic Integrated Circuits: from chip to system”

BERNABE Stéphane (Project Leader – Photonic Circuits and Modules, CEA-LETI) – Makalu Room

Free of Fees – Registration has to be done to jean-charles.souriau@cea.fr

Thursday June 23^rd

8h45 Welcome to MiNaPAD

9h00 Opening by Alexandre Val (Auditorium)

9h30 Keynote : Pivotal SiP Enabling comprehensive heterogeneous integration

Dr. CP HUNG – Vice President of Corporate R&D, ASE group

10h15 – 10h40 Exhibition Opening (Exhibition Hall) / Coffee break sponsored by

SESSION A: Manufacturability

(Auditorium)

10h45

11h10

11h35

Enabling additive Cu and Ag circuitry techniques for RF and Power device miniaturization

(R. De WIT, HENKEL, The Netherlands)

Digital, multi materials, non-contact large area printer for advanced packaging applications

(S. ETIENNE, I-O-TECH, Israel)

Packaging of a GaN power device 30 à 300W: from prototyping to mass production solution

(D. BERGOGNE, Wise Integration, France)

12h00 – 13h15 Lunch (Exhibition Hall) sponsored by

SESSION B: Process Optimization

(Auditorium)

13h20

13h50

14h20

14h50

Plasma cleaning technology for microelectronics assembly processes

(R. FURUKAWA, PANASONIC, Japan)

The Feasibility and Reliability Study on Lowering the Au Ball Wire Bonding Process Temperature

(G. LIN, ASE Group, Taiwan)

Atmospheric Plasma System for In-Line Surface Activation of Die-to-Wafer Direct and Hybrid Bonding

(D. PASCUAL, ONTOS PLASMA, USA)

Usage of NanoWires in Power Modules and Frequency converters

(O. BIRLEM, NANOWIRED, Germany)

15h15 – 15h40 Exhibition / Coffee break sponsored by

SESSION C: Fan In / Fan Out

(Auditorium)

15h00

15h30

Trends in Silicon Scaling. A Versatile Approach towards Cost-Aware Heterogenous integration

(R. ANTONICELLI, JCET, Europe)

III-V chips-based RF transceiver built by fan-out wafer level packaging

(A. GARNIER, CEA LETI, France)

SESSION D: Flip Chip process

(Auditorium)

16h00

16h30

Die-to-Wafer hybrid bonding equipment: Throughput versus precision

(P. METZGER, SET Corporation, France)

Ultra-reliable fine pitch Flip Chip connections for Space applications – but not only from 50µm ball diameter upwards, multiple materials

(D. NEGREA, AEMTEC, Germany)

SESSION E: Modeling and Simulation

(Auditorium)

SESSION F: Dicing / Picking

(Mont Blanc)

17h00

17h30

Impact of the assembly process on the mechanical behavior of integrated circuit packages. Application on FCBGA package

(Y. BOUTALEB, ST MICROELECTRONICS, France)

Molding Process Simulation: A Way to Anticipate Failures

(M. ROVITTO, ST MICROELECTRONICS, Italy)

Laser grooving process improvement to avoid recast growth during reliability stresses

(C. MOUTIN, ST MICROELECTRONICS, France)

Ultra-Short Pulse Laser and matrix beam technology

(J. Van BORKULO, ASMPT, The Netherlands)

18h10-18h30 Exhibition

19h00 Social Event : Les Jardins de Sainte Cécile Sponsored by

19h00-20h00: Spring Trio jazz

20h00: Diner

Friday June 24^th

8h30 Keynote : Digital packaging for automotive

Jérôme LOPEZ – ST MICROELECTRONICS

Session G: Reliability (Auditorium)

9h15

9h45

10h15

A new halogen-free vapor phase organic coating for high reliability & protection of miniaturized and dense electronics in harsh environments

(R. KUMAR, SCS COATINGS, USA)

Ultra-thin base materials take PCB miniaturization to the next level

(D. SCHULZE, DYCONEX, SWITZERLAND)

Influence of grain morphologies and anisotropic properties on the stress state of BGA solder joints

(E. BEN ROMDHANE, IMS Laboratory, France)

10h45 – 11h10 Exhibition & Coffee break (Exhibition Hall) ) sponsored by

Session H: Interposer 2,5D / 3D and TSV

(Auditorium)

Session I: Flexible Electronics

(Mont Blanc)

11h10

11h40

Assessment of moisture impact on 3D integrated stack

(L. MISCHLER, ST MICROELECTRONICS – IMS Laboratory, France)

Technology and Market Trends of High-End Performance Packaging – 2.5D & 3D

(S. CHITORAGA, YOLE DEVELOPMENT, France)

Photonic Packaging development for thin and skin compliant wearable medical device

(A. AITMANI, CEA LETI, France)

Chip-In-Flex: Integration of ultra-thin bare silicon chips within a flexible film

(J-C. SOURIAU, CEA LETI, France)

12h10 – 13h15 Lunch & Exhibition (Exhibition Hall) sponsored by

Session J: Opto Electronics – Photonic

(Auditorium)

13h15

13h45

14h15

Advanced packaging and test solutions for silicon photonics applications

(J. Chen, ASE group, Taiwan)

Adhesives for use in optical sensor assembly

(D. CERNEUS, CAPLINQ Europe, The Netherlands)

Packaging of a 256 channels Optical Phase array for Autonomous driven vehicles-oriented LiDAR

(T. MOURIER, CEA LETI, France)

14h45-14h50 Closing by Alexandre Val (Auditorium)

14h50 -16h00 Exhibition /Coffee Break

16h00 End of MiNaPAD 2022 conference

Venue

By train

By road

A few distances

Plane

Program

EXHIBITORS

Sponsors