Will be held on-site at Chalmers University of Technology, Gothenburg, Sweden. The NordPac conference is a strong platform that brings together academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics components, packaging, integration, and manufacturing technologies at the Nordic, European and international scale. NordPac provides a perfect opportunity to hear the latest news and developments in the field.
23rd-24th June 2022: MiNaPAD 2022 – IMAPS Europe
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress centre
MiNaPAD is a 2-day conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
- parallel technical sessions
- an exhibition
- additional technical events
Grenoble – Europe’s conveniently located technology cluster for semiconductor research, design and manufacturing – easy access to Lyon (1 hour), Geneva (2 hours), Paris (3 hours by high speed train– TGV) airports
5th-6th July 2022: CPE 2022 – IMAPS Europe
At the University of Warwick, UK
The Centre for Power Electronics (CPE) Annual Conference at the University of Warwick, Coventry, UK on 5-6 July 2022 will bring together the Power Electronics, Machines and Drives Community to review the latest Research and Development that will impact the Electric Revolution. This Conference will feature Invited Keynotes and Presentations from Leading Academics and Industrialists, views of the Future Demands for Power Electronics and Drives and Opportunities for Pursuing a Career in this exciting field.
13th – 15th July 2022: CICMT 2022 – IMAPS Europe
WKÖ – Veranstaltungscenter Wirtschaftskammer Österreich, Vienna, Austria
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies.
This international conference features ceramic technology for both microsystems and interconnect applications in a multi-track technical programme.
18th- 20th July 2022: HITEN 2022 – IMAPS Europe
St. Anne‘s College in the University of Oxford, UK
The HiTEN Conference is a forum that brings together researchers and practitioners in academia and industry from all over the world. Although HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
13th-16th September 2022: ESTC 2022
The Electronics System-Integration Technology Conference (ESTC) is a premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the high Carpathian Mountains and Cibin river. Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.
28th-30th October 2022: IMAPS Czech and Slovak Flash Conference 2022 – IMAPS Europe
Brno University of Technology
With pleasure we invite all prospective authors to participate in IMAPS-Czech and Slovak 8th annual IMAPS flash 2022 conference, which will be held by the end of October 2022 at Brno University of Technology, FEEC, Department of Microelectronics.