THERMAL 2024
Thermal management remains a crucial constraint in electronics packaging and is a mandatory aspect in every industry – aerospace, automotive, consumer, industrial, military – technology roadmap worldwide.
The upcoming workshop will present some latest improvements in thermal management solutions at system level, in power electronics, in materials, in modelling and in techniques for characterizing and testing materials. It will also present some innovative cooling solutions such as two-phase technologies and liquid cooling.
How to get about
By road:
Paris: 467 km
Lyon: 650 km
Marseille: 825 km
Nantes: 146 km
Bordeaux: 180 km
Toulouse: 400 km
Strasbourg: 950 km
By train (high speed train):
Paris-La Rochelle : 2h50
SNCF : 33 892 35 35 35 (0.34€ per minute)
www.voyages-sncf.com
By plane:
Attractive discounts, up to -15%, on a wide range of public fares on all AIR FRANCE, KLM and their code-shared flights worldwide.
Event: WORKSHOP THERMAL MANAGEMENT
ID Code:
Travel Valid Period: 29/01/2024 to 13/02/2024
Event location: BORDEAUX
Please visit the event website or access directly through http://globalmeetings.airfranceklm.com/Search/promoDefault.aspx?vendor=AFR&promocode=36285AF
Airport La Rochelle / Ile de Ré
Tél. : 33 5 46 42 30 26
www.larochelle.aeroport.fr
Southampton – La Rochelle : 1h20 (4 flights per week from April to September)
Birmingham – La Rochelle : 1h35 (3 flights per week from May to September)
Manchester – La Rochelle : 1h55 (1 flight per week from May to September)
Glasgow – La Rochelle : 1h20 (1 flight a week from May to September)
Flights operated by Flybe : www.flybe.com
Bristol – La Rochelle : 1h20 (4 flights per week from May to September)
Londres Gatwick – La Rochelle : 1h35 (5 flights per week from July to September)
Flights operated by Easyjet : www.easyjet.com
Londres Stansted – La Rochelle : 1h25 (4 flights per week from March to October)
Dublin – La Rochelle : 1h50 (2 flights per week from April to October)
Bruxelles Charleroi – La Rochelle : 1h30 (2 flights per week from June to October)
Oslo – La Rochelle : 2h (Flights from April 2010)
Flights operated by Ryanair : www.ryanair.com
Edimbourg – La Rochelle : 1h50 (2 flights per week from May to September)
Leeds – La Rochelle : 1h45 (1 flight a week from May to September)
Flights operated by Jet2 : www.Jet2.com
Cork – La Rochelle : 1h10 (2 flights per week from May to August)
Flights operated by Aer Arann : www.aerarann.com
Lyon – La Rochelle : 1h55 (2 flights a day – all year long)
Nice La Rochelle : 2h30 (1 flight a week from May to September)
Flights operated by Airlinair : www.airlinair.com
CONFERENCE SCHEDULE
31st January 2024 (Wednesday)
| 9h15 am | Opening address & table tops presentation
Jean-Yves Soulier, Conference chairman & IMAPS France Treasurer
|
Session 1: ACTIVE & PASSIVE TWO-PHASE COOLING
Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)
| 9h30 am | Acoustically-Enhanced Two-Phase Heat Recovery
Thomas R. Boziuk and Ari Glezer (Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA) |
| 9h55 am | Innovative high performance multisource capillary evaporators for 2Φ ammonia MPL dedicated to thermal control of highly dissipative space electronic systems Benjamin Lagier1,2, Frédéric Boudesseul1,3
(1IRT Saint-Exupéry; 2Airbus Defense and Space; 3THALES Alenia Space, Toulouse, France)
|
10.20 am-10.45 am Coffee Break / Table Top Exhibition
SESSION 1 (cont’d): ACTIVE & PASSIVE TWO-PHASE COOLING
Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Alexandre Val (Valeo)
| 10h45 am | The concept of 2-phase cooling of power electronics based on the M-cycle: modelling and prototyping
Maria Strąkowska, Mariusz Felczak, Marcin Kałuża, Robert Olbrycht, Dmytro Levchenko, Bogusław Więcek (Łódź University of Technology, Institute of Electronics, Poland)
|
SESSION 2: LIQUID COOLING
Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)
| 11h10 am | Optimizing Thermal Performance: Machine-Learning Insights for Closed-Loop Oscillating Heat Pipes (CLOHP)
Mira Ibrahim and Majed-Eddine Moustaid (Capgemini Engineering, Physical & Mechanical Eng. Department, Blagnac, France) |
| 11h35 am | Optimisation of lattice structure heat sink design for railway power module liquid cooling
Jean-Pierre Fradin1, Ahmad Batikh1, and Antonio Castro Moreno2 (1 ICAM Toulouse; 2 IRT Saint Exupéry, Toulouse, France) |
12:00 pm – 01.45 pm Lunch
SESSION 3: MATERIALS & TIM’s
Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Jean-Yves Soulier (Safran Data Systems)
| 1h45 pm | Thermal Interface Materials in Liquid Immersion for Power Electronics and Computing Systems
David L. Saums (DS&A LLC, Amesbury, MA, USA) |
| 2h10 pm | Low Melt Alloy Technology for use as a Thermal Interface Material
Tim Jensen (Indium Corporation, USA) |
| 2h35 pm | Novel TIM1 paste development based on hybrid silver sintering technology
Liao Yile, Kang Sungsig, Keith Tan, Abito Danila, Lo Miew Wan (Heraeus Materials Singapore Pte. Ltd, Global Business Unit Heraeus Electronics) |
| 3h00 pm | Metal-Diamond Composites using insert-technology for the realization of complex shaped thermal management solutions
E. Neubauer1, M.Kitzmantel1, D.Dewire2, J.Vriens2 (1RHP-Technology GmbH, Seibersdorf, Germany; 2Hi-Rel Alloys – A Qnnect Company, Niagara Falls, ON L2H 0Y5, Canada) |
03.25 pm – 03.50 pm Coffee Break / Table Top Exhibition
| 3h50 pm | Sintering and semi-sintering solutions for high power density electronics
Pascal Sbrovazzo (HENKEL, France) |
| 4h15 pm | Cement-based ceramic potting compound for the power electronics
Tamara Albert1, Christophe Féry1, Tjark Köbinger2, Bastian Raab3 (1 Heraeus Deutschland GmbH & Co. KG – Electronics; 2 Fachhochschule Kiel, Germany; 3 Technische Hochschule Nürnberg Georg Simon Ohm, Germany) |
SESSION 4: CHARACTERIZATION & TESTS
Chairs: Bruno Levrier (BL Expertises) / Mohamad Abo Ras (NANOTEST)
| 4h40 pm | Exploring Relaxation and Recovery Effects in Thermal Interface Materials
Santiago Campos-Boettges, Antonio Harder and Mohamad Abo Ras (NANOTEST, Germany) |
| 5h05 pm | RMS current measurement in energetic lines independently of the environmental conditions using IR thermography
Błażej Torzyk, Bogusław Więcek (Łódź University of Technology, Institute of Electronics, Poland) |
| 5h30 pm | Material innovation redefining power module packaging
Low Shuey Seng (Sumitomo Bakelite Singapore Pte. Ltd, Singapore) |
05.55 pm – 06:30 pm End of 1st day Sessions / Table top Exhibition
06:30 pm – 10:00 pm Social Event : Aquarium La Rochelle & Dinner
1st February 2024 (Thursday)
SESSION 4: CHARACTERIZATION & TESTS (COnT’D)
Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Alexandre Val (Valeo)
| 8h45 am | A measuring device for thermal impedance, thermal conductivity and thermal interface resistance
Hans-W. Marx (Linseis Messgeräte GmbH, Germany) |
| 9h10 am | Development of a Thermal Test Vehicle to Explore Thermal Pathways in Packages
with Large Die Areas through Thermal Transient Impedance Analysis Mohamad Abo Ras, Maik Sternberg, Daniel May (NANOTEST, Germany) |
| 9h35 am | TDM technology, solutions to measure both in-plane (CTE) and out-of-plane (warpage) deformations
Thomas Moncond’huy (INSIDIX, France) |
10:00 am – 10.25 am Coffee Break/ Table top Exhibition
SESSION 5: MODELLING & SIMULATION
Chairs: Jean-Pierre Fradin (ICAM Toulouse) / Jean-Yves Soulier (Safran Data Systems)
| 10h25 am | Multi-scale simulation of GaN power Amplifier in FanOut Wafer Level Packaging
technology (FOWLP) Luc Kakou, Raphael Sommet, Jean Christophe Nallatamby (XLIM Limoges University Laboratory, France) |
| 10h50 am | Benefit of accurate electronic component thermal modeling and calibration for
the driver product Daliang Zhong1, Vishweshwara Shanbhog2, Álvaro Andrés3 (1 Valeo Lighting Systems, Guangdong, China; 2 Valeo India Private Limited (Lighting Division), Republic of India; 3 Valeo España, Martos (Jaén), Spain) |
| 11h15 am | Multiphysics Numerical Modeling of Electronic Devices at SLB
Sophie Salvadori, Mahmoud Ali, Amandine Battentier (SLB, France) |
| 11h40 am | Physics-based thermal modelling of lithium-ion battery cells
Quentin Laporte (SERMA Energy, France) |
12.05 pm – 1:35 pm Lunch
SESSION 6: THERMAL-RELATED APPLICATIONS AND THERMAL ARCHITECTURE
Chairs: Bruno Levrier (BL Expertises) / Jean-Yves Soulier (Safran Data Systems)
| 1h35 pm | Thermal Management of Power Electronics for More Electric Aircraft
Hélène Calmels (Airbus Avionics & Simulation Products., France) |
| 2h00 pm | Realization of a Multi-Material Packaging for a Complete Functional electronic Unit
Muriel Sabah (Safran Electronics and Defense, Massy, France)
|
| 2h25 pm | Development of a Lightweight Flight Recorder in accordance to ED-155 standard
G. Ortiz, S. Horbach, D. Marty, G. Roquet (SERMA Technologies, France) |
| 2h50 pm | The cooling as a central parameter for affordable on-board charger: the PIACHPA
project case study A. Marie1, J. Hélie2, JP. Fradin1, F. Fabre2 (1ICAM Toulouse France, 2Vitesco Technologies France) |
End of Conferences/Closing address: J-Y Soulier, Conference Co-Chairman
3.15 pm – 03.45 pm Final coffee break and farewell