MINaPAD Forum 2023
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on June 7-8, 2023.
MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
- parallel technical sessions
- an exhibition
- additional technical events (June 6, 2023)
By train
- Train station at 100m of Congress center
- Several daily connections with Europe’s big cities:
- Grenoble-Paris: 10 direct TGV high speed trains, in 3 hours
- Grenoble-Lille-Bruxelles: 1 TGV high speed train per week, in 5.5 hours
- Grenoble-Paris-Cologne: 4 TGV high speed trains per day, in 8 hours
- Grenoble-Turin-Milan: 3 round trips per day;
By road
A crossroads, Grenoble is particularly easy to access? Arrival by motorways A48 (Lyon, Valence), A41 (Chambery, Annecy), and A51 (Marseille)
A few distances
- Grenoble-Paris: 574 km
- Grenoble-Nice: 343 km
- Grenoble-Strasbourg: 535 km
- Grenoble-Geneva: 147 km
| Categories | Number | Capacity |
| Hotel**** | 2 | 55 |
| Hotel*** | 23 | 1420 |
| Hotel** | 50 | 1868 |
| Hotel* | 6 | 586 |
| Total | 81 | 3929 |
Plane
Attractive discounts, up to -15%, on a wide range of public fares on all AIR FRANCE, KLM and their code-shared flights worldwide.
Event: MINAPAD2023
ID Code:
Travel Valid Period:
Event location: Grenoble
Please visit the event website or access directly through
Grenoble Airport Isère 40 minutes
http://www.grenoble-airport.com
Railway station-Airport every three hours from 5.15 am to 6.05 pm Time 45mn
Airport-Railway station every three hours from 10.10am to 10.30 pm
Lyon St Exupery Aiport distance 50 minutes
Shuttles:
Airport-Grenoble every hour 7.30 am to 7.00pm
Time 1 hour
Grenoble-Airport every hour 5.00 am to 7.00
Time 1 hour
Geneve Airport Cointrin distance 1.30 pm
Shuttles
Airport –Grenoble every 3 hours 8.30 am to 7.30 pm time 2 hours
Grenoble-Airport every 3 hours 6.00 am to 4.00 pm time 2 hours
Local Transport
Tramway
Line A Stop Railway station
Line B Stop Palais de Justice
Parking
Europole Railway Station 600 places, rue du Doyen Louis Weil
Le Doyen 400 places, rue du Doyen Louis Weil
Wednesday June 7th
8h45 Welcome to MiNaPAD
9h00 Opening by Jean-Marc YANNOU (Auditorium)
9h30 Keynote: Laurent HERARD (STMicroelectronics – BEMT R&D Manager)
Packaging innovation – A key enabler for future mobility
10h15 – 10h40 Exhibition Opening (Exhibition Hall) / Coffee break sponsored by
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SESSION A: Wafer Level Packaging & Flip Chip (Auditorium) |
SESSION B: Characterization & Reliability (Mont Blanc) |
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10h45
11h15
11h45
12h15
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Advanced vertical interconnections for fan-out wafer level packaging applications (Aurelia Plihon / CEA-Leti – France)
Advanced Package Platform VIPACK : FOSiP (Chin-Cheng Kuo /ASE group – Taiwan)
Packaging of a 25 flip chips module on large dimension AlN ceramic substrate keeping low dead areas and tight planarity (Sarah Renault /CEA-Leti – France)
Fabrication and characterization of a 2 layers face-to-back test vehicle with high density TSV (Jerzy-Javier Suarez-Berru / CEA-Leti – France) |
Comparative study on electrical performance of wire-bonded BGA packages using non-plating line vs etch-back technology (Damian Halicki / STMicroelectronics – Italy) Comparative study of thermal fatigue life of polymer core solder balls (PCSB) and SAC solder balls in BGA interconnections (I. Malkorra / ESME – France) Thermal characteristic study of epoxy molding compound with different filler composition (Bo Yu Huang / ASE group – Taiwan) Finite elements analysis of solder joints during thermal shock tests correlation with dye penetration (Khalil Maarouf / VALEO – France) |
12h45 – 13h35 Lunch (Exhibition Hall) sponsored by
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SESSION C: Interconnections (Auditorium) |
SESSION D: MEMs & Optical Packages (Mont Blanc) |
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13h40
14h10
14h40
15h10
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The study of pure Cu and Pd coated Cu wire-bonding on nano-twinned Cu pad/finger (Erh-Ju Lin / ASE group – Taiwan)
Cu second bond response on thin silver pre-plated leadframe packages (Mirko Alesi / STMicroelectronics – Italy)
Next generation lead-free solder paste for advanced packages (B. Senthil Kumar / HERAEUS – Germany)
Multiphase full wave system (Jean-Christophe Riou / SAFRAN – France) |
Test on package: design and manufacturing of package aimed to electromechanical characterization of MEMS structures (Marco Del Sarto / STMicroelectronics – Italy) 3D silicon photonic interposer process integration for chiplet based 3D systems (Damien Saint-Patrice / CEA-Leti – France) Wafer level optical package for ambient light sensor for mobile and wearable applications with integrated multi-lens array (Niek van Haare / BESI – Netherlands)
3D heterogeneous integration of meta surface lens in an optical package (Patrick Laurent / STMicroelectronics – France) |
15h40 – 16h00 Exhibition / Coffee break sponsored by
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SESSION E: Panel Session (Auditorium) |
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16h05
16h30
16h55
18h00 |
Writing Invention Disclosures to Optimize Patent Value in Europe and the U.S (Richard P. Gilly / Archer & Greiner P.C. – USA)
Advanced packaging technology & market trends (Bilal Hachemi / YOLE Developments – France)
*************************************** Round Table: The Reindustrialization of Semiconductor Packaging in Europe in the context of the EU Chips Act
Moderator: BOULAY Sanae (NXP) and De LANGLADE Renaud (EPOSS) Speakers: IBRAHIM Mario (AT&S), OBERNDORFF Pascal (NXP), HERARD Laurent (STMicroelectronics), YANNOU Jean-Marc (ASE Europe), David HIEN (EGIDE)
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18h30 Social Event : Château de la Commanderie Sponsored by
18h30-19h00: Transportation by FAURE Bus from WTC conference
19h00-20h00: Appetizers & Music by Alpes concerts
20h00: Dinner
22h30: Return to WTC conference by FAURE Bus
Overview Château de la Commanderie (38320 EYBENS)
Thursday June 8th
8h30 – Opening exhibition and conferences
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Session F: Encapsulation (Auditorium) |
Session G: BGA manufacturing (Mont Blanc) |
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08h45
09h15
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The phenomenon of creep and overflow in gel dispense process (Shih Kun Lo / ASE group – Taiwan) Enabling semiconductor packaging materials for advanced flip-chip and heterogeneous integration (Ruud de Wit / HENKEL – Netherland) |
Advanced IC substrates – challenges in manufacturing and supply chain (Daniel Schulze / DYCONEX – Switzerland) Fabrication and characterization of soft polymer core solder balls (PCSB) for BGA interconnections (I. Malkorra / ESME – France) |
9h50 Keynote: Pascal OBERNDORFF (NXP – Head of Package Core Technology)
Title
10h30 – 10h50 Exhibition & Coffee break (Exhibition Hall) sponsored by
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Session H: Manufacturing – Plasma (Auditorium) |
Session I: Manufacturing – Equipment’s (Mont Blanc) |
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10h55
11h25
11h55
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Panasonic plasma cleaning technology and predictive maintenance by using plasma monitor function (James Weber / PANASONIC – Germany) Cleaning of silicone and hydrocarbon contact residue using atmospheric plasma (Daniel Pascual / ONTOS Equipment Systems – USA) Improving CCP chamber-plasma-cleaning performance using plasma light emission (OES) analysis data (Jong Won Oh / VISION Semicon – Republic of Korea) |
Advanced laser grooving and dicing to enable high quality separation of next generation thin semiconductor devices (Gerald Klug / DISCO – Germany) Direct writing technologies for interconnection in electronic packaging (Elodie Pereira / CTTC – France)
An innovative contactless technology for high resolution, high speed, conductive & dielectric materials deposition (Stéphane Etienne / I-O-TECH, Israel) |
12h25 – 13h30 Lunch & Exhibition (Exhibition Hall) sponsored by
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Session J: Advanced Interconnections (Auditorium) |
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13h35
14h05
14h35
15h05 |
Development of stretchable and removable electrical interconnection solution for ultra-thin electronic components (Auriane Despax-Ferreres / CEA-LITEN – France) High density interconnect above active CMOS structures utilizing optimized klettwelding of nanowires (Andreas Kramer / TU Darmstadt – Germany) The failure mechanism of µ-CuP employed in sensor packages (Erh-Juh Lin / ASE group – Taiwan) Hybrid in-mold electronics process towards novel 3d packaging of components and systems (Philippe Lombard / University of Lyon – France) |
15h35 Closing by Jean-Marc YANNOU (Auditorium)
15h40 -16h00 Exhibition /Coffee Break
16h00 End of MiNaPAD 2023 conference