Device Packaging 2022
The 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
The conference will feature the three following technical tracks and an interactive poster session:
- Heterogeneous 2D & 3D Integration
- Fan-Out, Wafer Level Packaging & Flip Chip
- Automotive, 5G & Next Gen Applications
The program will exist of technical presentations in topical sessions, keynotes and panalists, as well as poster presentations. Additionally, DPC 2022 will offer supplementary classroom style education in the form of two-hour short courses taught by industry leaders.