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Who We Are...


Welcome to the IMAPS France

IMAPS France (International Microelectronics And Packaging Society, France chapter) is a non-profit organization with 200 members in 2015 from 110 companies or institutes in France and neighboring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World. Our mission is to promote and to disseminate knowledge and know-how throughout France and Europe, related to the packaging and assembly of semiconductor devices.

 To that end, we organize  public events each year. In 2016, in French OR English language. These are namely:


  • POWER 2016
  • MEDICAL 2016
  • THERMAL 2017


We will be glad to see you join us for one of these events.

Bulletin d'adhésion IMAPS FRANCE




Upcoming Events:






 The French IMAPS Chapter presents the 4th Advanced Technology Workshop on Microelectronics, Systems and PackagingFor Medical Applicationsin Lyon
                                             Save the date: 7-8 december 2016

Fo more than 40 years IMAPS is the leading Microelectronics Packaging, Interconnect and Assembly society, facilitating means of communication, education and interaction at all levels. IMAPS is dedicated to the advancement and growth of the community, with focus on developments in packaging technologies of the present and future (3D Integration, SMT, CoB- and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, MEMS, High Frequency, Advanced Materials, Modelling/Design/Simulation, Reliability amongst others).At the ATW MEDICAL 2016, we will provide you with excellent presentations and exhibitors of most recent research and development results worldwide. Bringing together the microelectronics implantable and wearable, administrative regulations and marketing professionals. The variety of sessions offer the possibility to enhance professional development, technical knowledge/skills and enables career progression. Furthermore, the industrial exhibition will highlight materials, products, equipment and service applications of the current technology. We look forward to welcoming you to an inspiring and stimulating event.

The conference is an important platform for the dialogue between industry (manufacturers) and academia (researchers). Don’t miss the opportunity to meet international experts and exchange experience, ideas and cutting edge information of microelectronics and packaging industries at the ATW MEDICAL 2016.

ATW MEDICAL 2016 is pleased to welcome all participants to LYON METROPOLE congress hotel (http://www.resorthotellyon.co.uk ).






The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.  

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. 

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also 

greater reliability; these trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels. 






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