IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.
The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.
Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !
IMAPS-France (French chapter) is a non-profit organization with 200 members in 2017 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.
To that end, we organize events each year. In 2018, in French OR English language, these are namely:
We will be glad to see you join us for one of these events.
IMAPS-France Micro/Nano-electronics Packaging and Assembly, Design and manufacturing Forum. MiNaPAD Conference is the major electronics packaging, interconnection and integration conferences of France, and will be held at the WTC (World Trade Center) Grenoble, 16Th 17th Mayl 2018.
Following the success of the Power Electronics Workshop organized over the past 9 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France proudly announces the 10th edition of the Power Electronics and Packaging, Technical & International Workshop to be held in Tours, France on 8th November 2018 The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river. For the fifth time, the event’s scope becomes international and the workshop will be held in English
The workshop will present latest improvements in thermal management materials, components and systems,
to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.
Increases in functionality, complexity, miniaturisation, operating temperature and power output require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.
Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also a greater reliability. These trends also require improvements and changes in packaging and thermal materials.
Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels