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Who We Are...

 

Welcome to the IMAPS France

 

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.

 The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !

 IMAPS-France (French chapter) is a non-profit organization with 200 members in 2015 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

To that end, we organize events each year. In 2016, in French OR English language, these are namely:

 

  • MEDICAL 2016
  • THERMAL 2017
  • DEMESYS 2017
  • RAMP 2017
  • MINAPAD 2017
  • DEMESYS 2017
  • POWER 2017
  • MEDICAL 2017

 

We will be glad to see you join us for one of these events.

Bulletin d'adhésion IMAPS FRANCE

 

 

 

Upcoming Events:


MEDICAL 2016

MEDICAL 2016


 

 The French IMAPS Chapter presents the 4th Advanced Technology Workshop on Microelectronics, Systems and PackagingFor Medical Applicationsin Lyon
                                             Save the date: 7-8 december 2016
                                                     

Fo more than 40 years IMAPS is the leading Microelectronics Packaging, Interconnect and Assembly society, facilitating means of communication, education and interaction at all levels. IMAPS is dedicated to the advancement and growth of the community, with focus on developments in packaging technologies of the present and future (3D Integration, SMT, CoB- and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, MEMS, High Frequency, Advanced Materials, Modelling/Design/Simulation, Reliability amongst others).At the ATW MEDICAL 2016, we will provide you with excellent presentations and exhibitors of most recent research and development results worldwide. Bringing together the microelectronics implantable and wearable, administrative regulations and marketing professionals. The variety of sessions offer the possibility to enhance professional development, technical knowledge/skills and enables career progression. Furthermore, the industrial exhibition will highlight materials, products, equipment and service applications of the current technology. We look forward to welcoming you to an inspiring and stimulating event.

The conference is an important platform for the dialogue between industry (manufacturers) and academia (researchers). Don’t miss the opportunity to meet international experts and exchange experience, ideas and cutting edge information of microelectronics and packaging industries at the ATW MEDICAL 2016.

ATW MEDICAL 2016 is pleased to welcome all participants to LYON METROPOLE congress hotel (http://www.resorthotellyon.co.uk ).

 

THERMAL 2017

THERMAL 2017


 

 February 1st & 2nd, 2017

The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.  

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. 

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also 

greater reliability; these trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels. 

MINAPAD 2017

 

MINAPAD 2017


DEMESYS 2017

DEMESYS 2017

 

After a successful First Edition on 2015, Moroccan Foundation for Advanced Science Innovation and Research (MAScIR), International Microelectronics Assembly and Packaging Society (IMAPS-France) and Electronic, Microelectronic et Mechatronic Cluster of Morocco (CE3M), are pleased to announce the Call for Papers for the 2nd Edition of DeMESys: the International Conference on Development and Manufacturing of Electronic Systems. This conference will be held at Rabat Design Center and will feature 2 days of selected technical presentations focusing on a range of important topics related to the Electronic & Microelectronic systems and their applications.

DeMESys conference is the occasion for attendees involves in the electronic supply chain to present recent researches, exchange about new ideas and solutions, and explore opportunities for the future.