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Prochains évènements IMAPS France

Next IMAPS France events

                 

 1. "Puissance Tours 2013"

From Nano to MacroPower Electronics and PackagingWorkshop

7 November 2013 - TOURS, FRANCE

 

Following the success of the Power Electronics Workshop organized over the past three years in partnership with GREMAN (UMR 7347) and Polytech Tours, IMAPS-France proudly announces the 4th edition of the Power Electronics and Packaging Technical Workshop to be held in Tours, France on November 7, 2013.

The city of Tours is located along the scenic Loire Valley which is famous for its castles built along the river.

As of this year, the event’s scope becomes international : the workshop will be held in English as the official language.

TECHNICAL COMMITTEE:

Christophe SERRE ST Microelectronics -Tours Chairman

Stéphane BELLENGER IPDiA Chairman

Daniel ALQUIER Laboratoire GREMAN

Cyril BUTTAY Laboratoire AMPERE

Yves OUSTEN Laboratoire IMS

Pierre LEWANDOWSKI CONTINENTAL Automotive

Philippe PONS AIRBUQ

Siegfried HERMANN OSRAM

We invite speakers to submit abstracts relating to the following topics:

- Power management for transportation and industrial systems

- Energy harvesting systems, from nano to macro (smart grid, wind energy, photovoltaic, etc…)

- Energy conversion systems– from power to emission (lighting, ultrasonic, infrared, etc…)

These topicscould be developed around several themes, such as:

- New materials and substrates dedicated to power electronics

- Thermal or thermo mechanical or regulatory constraints (RoHS regulation, REACH, etc…)

- Dedicated technologies for integration and optimisation of power systems,including passive components (weight and size reduction, yield improvement, efficiency, etc…)

- Innovative technologies, materials and processes dedicated to interconnectionand packaging (die attach, bonding wire & ribbon wires, 3D power components, etc…)

- Reliability and failure modes (impacts linked to technologies, thermal constraints, radiation, etc…), predictive methods, design of experiments, reliability.

- High current and high voltage or extremely high voltage: impact on packaging technologies.

Presentations will be 25 minutes in length, including 5 minutes for questions and answers. The abstract submission deadline is
June 14th. Please submit abstracts in word format,including the names of the company or institution, the speaker and associated author(s), the title of the conference and an abstract of 250-600 words. Paper acceptance will be communicated prior to June 28th.

For further information, please contact Florence VIRETON Tel: +33 (0) 1 39 67 17 73

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