Overview: The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in Lyon on Microelectronics, Systems and Packaging for Medical Applications on November 22th and 23th, 2017. The workshop will bring together technologists in semiconductor packaging with life science experts interested in applying advanced packaging methods to enable the next generation of medical microelectronic devices. The workshop will provide a venue for presentations and discussions focused on traditional and emerging packaging technologies for wearable, portable and implantable devices, medical instrumentation, and life sciences consumables. Attendees and Exhibitors will be exposed to a wide variety of disciplines to encourage new products, discussions and collaborations. This 2-days event will bring together invited experts in the medicine, sensing, microelectronics, and semiconductor packaging.