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Who We Are...

 

Welcome to the IMAPS France

 

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies.

 The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites.

Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World !

 IMAPS-France (French chapter) is a non-profit organization with 200 members in 2017 from 110 companies or institutes in France and neighbouring countries (Belgium, Switzerland, Morocco, Spain, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

To that end, we organize events each year. In 2018-2019, in French OR English language, these are namely:

 

 

We will be glad to see you join us for one of these events.

 

 

 

 

Upcoming Events:

 

 

THERMAL 2019

 

The workshop will present latest improvements in thermal management materials, components and systems,

to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems.  

Increases in functionality, complexity, miniaturisation, operating temperature and power output require advances in thermal solutions at many levels, for military, aerospace, consumer and industrial systems. 

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also a greater reliability. These trends also require improvements and changes in packaging and thermal materials.  

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint in packaging at all levels

MINAPAD 2019

 


 

  • MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on

             May 22-23, 2019

 

  • MiNaPAD is a 2 days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

         - parallel technical sessions

            - an exhibition.        

            - additional  technical events (May 21, 2019)